Large Computer Lead-free Reflow Oven series

Large Computer Lead-free Reflow Oven series

Product feature:

● Brand LCD computer and PLC controlling system, temperature accuracy is ±1℃; the reflow oven can continue manufacture offline and when computer crashes unexpectedly; that can ensure system more stable and reliable.

● Windows 2000 menu screen shot, powerful functions and simple operation.

●Double air cylinders lifting device is applied in top cover open system, that will make safe and reliable.

●Equipped with tension device in mesh system, smooth transmission, no shock, no deformation and those will make PCB running stably.

●It is synchronous chain transportation structure (which can connect automatic pick and place machine online) in the machine, that will ensure accurately width adjustment and long using life. (Chain is optional)

●Automatic lubrication system is designed in the reflow oven; filling time and amount can be set and then lubricate transmission chain automatically according to setting.

●All heating zones are controlled by computer and PID, Every temperature zone can be set and started independently.

●Mesh/Chain transmission system is controlled by computer, it is closed loop; all kinds of PCBs can be manufactured at same time.

●Sound and light malfunction alarm system is applied in reflow oven.

●There is leakage protection to ensure operators and machine safe.

●Build-in UPS and automatic delay system are designed in the reflow oven, which will avoid damage PCB and reflow ovens when power off or over heating.

●Hot air circulation heating technology from HELLER has been applied, fast air vents improve greatly hot air flow, warm up will be fast and time is 20 min; high thermal compensation, it is suitable for high temperature soldering and curing.

●Separate temperature sensors have been designed in every temperature zone, which is used to monitor and compensate temperature balance at real time.

●To protect operators set, password can be set in operation system; software can save current temperature and speed setting and relate temperature curves, all data and reports can be printed.

●Equipped with online temperature measurement system for three temperature zones, it can measure and monitor real temperature at any time.

●Urgent cooling system is designed in reflow oven, with magnifying focus urgent cooling, the speed rate is up to 3.5~6℃/s; outside force cooling device can make soldering effect. (Force air cool system is standard design)

●Rosin recycle system is applied. Rosin is directional flowing, easy replacement and clean. Special channel is designed to exit exhaust.

●Special fan structure and abnormal heating wires design are used in the reflow oven; no noise, no vibration, high heating exchange, it is little temperature difference between BGA bottom and PCB boards. It is best for lead free soldering.

Specification: